Sensata IC | 0.3 mm Pitch CSP BGA Burn-In Test Sockets by Sensata

Contacts & Distributors

Brazil/Brasil

Simplified Chinese

Traditional Chinese

Europe

Japan

Malaysia

Korea

Search Sensata:

Burn-in Sockets
•	Products:
	–	BGA: 0.3 mm Pitch CSP 0.4 mm Pitch CSP 0.5 mm Pitch CSP 0.65 mm Pitch CSP 0.75 mm Pitch CSP 0.80 mm Pitch CSP 1.0 mm Pitch 1.27 mm Pitch Memory Sockets
	–	LGA
	–	QFP
	–	Others
•	Engineering
	–	Contact Technology: Buckling Beam Pinch Style
	–	Platform Design
•	Contact Us
•	Make an Online Request
•	Terms & Conditions

Looking for a specific socket? Click here.

Site Updated May 13th, 2013

Sensata > Products > Burn-in Sockets > BGA > CSP >

Burn-in Test Socket: 0.3 mm Pitch CSP

Our 0.3 mm-pitch socket is currently under development.

0.3 mm pitch CSP in development!

Call now. Let us capture your 0.3 mm-pitch input!

Tel: 1-508-236-1868

burninsockets@sensata.com

sensata.com/burninsockets

24/7 Worldwide Support

CSP Leaders

Interconnect Since 1970

See our ad in Chipscale Review magazine »

The World Depends on Sensors and Controls

©2013 Sensata Technologies, Inc.
All rights reserved.

Policies, Legal, Terms of Use

Employee my.Sensata